Ubuso buhebuje Umusozi PAR® Umuyoboro w'amashanyarazi w'inzibacyuho (TVS) DO-218AB SM8S
Ibyiza bya DO-218AB SM8S:
1. Bitewe nubuhanga bwa Chemical Etching Method, ibisubizo bibi byuburyo butaziguye bikurwaho.
2. Ifite imbaraga muburyo bwihuse kubera chip nini kuruta bagenzi babo.
3. Igipimo cyo kunanirwa cyane mubihe bitandukanye
4. Byemejwe na AEC-Q101 bisanzwe
5. Imikorere ya Diode itezimbere, yungukirwa no kurinda siyanse kumasano ya PN.
INGINGO Z'INGENZI ：
VBR: 11.1 V kugeza 52.8 V.
VWM: 10 V kugeza 43 V.
PPPM (10 x 1000 μs): 6600 W.
PPPM (10 x 10 000 μs): 5200 W.
PD: 8 W.
IFSM: 700 A.
TJ max.: 175 ° C.
Ubuharike: Uni-icyerekezo
Ipaki: DO-218AB
Uburyo bwo gukora Chip
1. Icapiro ryikora（Ultra-itomora byikora icapiro）
2. Automatic First-etching（Ibikoresho byikora byikora ， CPK> 1.67）
3. Ikizamini cya Polarite Automatic Test Ikizamini Cyuzuye lar
4. Inteko yikora （Yateje imbere Inteko ishinga amategeko）
5. Kugurisha (Kurinda hamwe nuruvange rwa Azote & Hydrogen
Kugurisha Vacuum)
6. Automatic Second-etching (Automatic Second-etching with Ultra-pure Water)
7. Gufata mu buryo bwikora (Uniform Gluing & Precise Calculation is Realised by Automatic Precise Gluing Equipment)
8. Ikizamini cya Thermal Automatic (Guhitamo Automatic by Thermal Tester)
9. Ikizamini cyikora (Ikizamini Cyinshi)
