Ubuso buhamye kandi bwizewe Umusozi PAR® Umuyoboro wamashanyarazi wigihe gito (TVS) DO-218AB SM5S
Ingingo zikomeye za DO-218AB SM5S:
1. Chip imbere itunganywa nubuhanga buyobora isi yose ya Chemical Etching Method, itarangwamo ingaruka mbi ziterwa no kugabanya imihangayiko.
2. DO-218AB ifite imbaraga zo gusubiza inyuma imbaraga, bitewe nubunini bwa chip kurenza abo bahanganye '.
3. Umuyoboro muke uva kumpera ya chip
4. Ubushobozi bwa TJ = 175 ° C bukwiranye nubwizerwe buhanitse kandi busabwa imodoka
5. Umuvuduko muto ugabanuka
6. Guhura na ISO7637-2 ibisobanuro byihariye (bitandukanye nibizamini)
7. Guhura na MSL urwego 1, kuri J-STD-020, LF ntarengwa ya 245 ° C.
Intambwe zo Gukora Chip
1. Gucapa mu buryo bwa mashini(Ikirenga-Gusobanura neza icapiro rya wafer)
2. Automatic First-etching(Ibikoresho byikora byikora , CPK> 1.67)
3. Ikizamini cya Polarite Automatic Test Ikizamini Cyuzuye lar
4. Inteko yikora (Yateje imbere Inteko ishinga amategeko)
5. Kugurisha (Kurinda hamwe nuruvange rwa Azote & Hydrogen
Kugurisha Vacuum)
6. Automatic Second-etching (Automatic Second-etching with Ultra-pure Water)
7. Gufata mu buryo bwikora (Uniform Gluing & Precise Calculation is Realised by Automatic Precise Gluing Equipment)
8. Ikizamini cya Thermal Automatic (Guhitamo Automatic by Thermal Tester)
9. Ikizamini cyikora (Ikizamini Cyinshi)